John H. Lau: mencari di tapak web Z-Library

Sumbangan 15 hb September 2024 – 1 hb Oktober 2024 Mengenai pengumpulan sumbangan

Akses percuma kepada pengetahuan dan budaya.

Sumbangan 15 hb September 2024 – 1 hb Oktober 2024

Z-Library - salah satu perpustakaan dalam talian terbesar di dunia yang menyimpan lebih daripada 17,000,000 buku dan 84,837,000 artikel. Kami bertujuan untuk buku boleh diakses oleh semua orang. Hari ini (15 hb September 2024) kami memulakan pengumpulan dana tambahan untuk menyokong dan mengembangkan projek.

Tambah lagi muat turun TANPA HAD (untuk 31 hari sejak menghantar sumbangan) boleh diakses oleh SEMUA pengguna yang menyumbangkan selama tempoh pengumpulan sumbangan hingga 1 hb Oktober 2024.

Mengenai pengumpulan sumbanganBaca lebih lanjut

Buku (33)
Yang paling popular
Senarai
- Senarai
- Jadual

1

Classical Chinese Literature: An Anthology of Translations - Volume I: From Antiquity to the Tang Dynasty

Classical Chinese Literature: An Anthology of Translations - Volume I: From Antiquity to the Tang Dynasty

Columbia University Press

John Minford, Joseph S.M. Lau

Tahun:

2000

Bahasa:

english

Fail:

PDF, 32.23 MB

0 / 0

english, 2000

2

Diseño de accesorios

Diseño de accesorios

Tahun:

2013

Bahasa:

spanish

Fail:

PDF, 19.74 MB

0 / 0

spanish, 2013

3

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Tahun:

2023

Bahasa:

english

Fail:

PDF, 30.19 MB

5.0 / 5.0

english, 2023

4

Heterogeneous Integrations

Heterogeneous Integrations

Springer Singapore

Tahun:

2019

Bahasa:

english

Fail:

PDF, 27.74 MB

0 / 0

english, 2019

5

Flip Chip Technologies

Flip Chip Technologies

McGraw-Hill Professional

Tahun:

1995

Bahasa:

english

Fail:

DJVU, 7.47 MB

0 / 0

english, 1995

6

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

McGraw-Hill Professional

John H. Lau, Ricky S.W. Lee, Ricky S. Lee

Tahun:

1999

Bahasa:

english

Fail:

DJVU, 6.68 MB

0 / 0

english, 1999

7

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

McGraw-Hill Professional

Tahun:

2000

Bahasa:

english

Fail:

DJVU, 8.39 MB

0 / 0

english, 2000

8

Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

McGraw-Hill Professional

John H. Lau, S.W. Ricky Lee

Tahun:

2001

Bahasa:

english

Fail:

PDF, 11.50 MB

0 / 0

english, 2001

9

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Tahun:

2024

Bahasa:

english

Fail:

PDF, 32.05 MB

0 / 5.0

english, 2024

10

Networking the Russian Diaspora: Russian Musicians and Musical Activities in Interwar Shanghai

Networking the Russian Diaspora: Russian Musicians and Musical Activities in Interwar Shanghai

University of Hawaii Press

Hon-Lun Helan Yang, Simo Mikkonen, John Winzenburg, Frederick Lau

Tahun:

2020

Bahasa:

english

Fail:

PDF, 8.80 MB

0 / 5.0

english, 2020

11

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Springer Nature

Tahun:

2023

Bahasa:

english

Fail:

EPUB, 316.34 MB

0 / 0

english, 2023

12

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

McGraw-Hill Professional

John H. Lau, Ricky S.W. Lee, Ricky S. Lee

Tahun:

1999

Bahasa:

english

Fail:

DJVU, 7.73 MB

0 / 0

english, 1999

13

Bongo Grammar Book

Bongo Grammar Book

SIL South Sudan

Daniel Rabbi Moi Mario Lau Babur Kuduku Sister Mary Mangira Michael Simon Hagimir John Rapheal Zakenia Paul Mafoi Nyoul Gulluma Kuduku

Tahun:

2014

Bahasa:

english

Fail:

PDF, 2.08 MB

0 / 0

english, 2014

14

Hydrology of the Hawaiian Islands

Hydrology of the Hawaiian Islands

University of Hawaii Press

L. Stephen Lau, John F. Mink

Tahun:

2006

Bahasa:

english

Fail:

PDF, 8.51 MB

0 / 0

english, 2006

15

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Springer-Verlag Berlin Heidelberg

John Alan Robinson (auth.), John Lloyd, Veronica Dahl, Ulrich Furbach, Manfred Kerber, Kung-Kiu Lau, Catuscia Palamidessi, Luís Moniz Pereira, Yehoshua Sagiv, Peter J. Stuckey (eds.)

Tahun:

2000

Bahasa:

english

Fail:

PDF, 13.12 MB

0 / 0

english, 2000

16

Hydrology of the Hawaiian Islands

Hydrology of the Hawaiian Islands

University of Hawaii Press

L. Stephen Lau, John F. Mink

Tahun:

2006

Bahasa:

english

Fail:

PDF, 31.44 MB

0 / 0

english, 2006

17

За сто лiт

За сто лiт

McGraw-Hill Professional

Tahun:

1930

Bahasa:

ukrainian

Fail:

DJVU, 7.31 MB

0 / 0

ukrainian, 1930

18

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Springer Nature

Tahun:

2021

Bahasa:

english

Fail:

PDF, 44.12 MB

0 / 5.0

english, 2021

19

Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Springer Singapore

Tahun:

2018

Bahasa:

english

Fail:

PDF, 25.20 MB

0 / 0

english, 2018

20

Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive

Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive

McGraw-Hill Professional

John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee

Tahun:

2002

Bahasa:

english

Fail:

PDF, 24.19 MB

0 / 0

english, 2002

21

Advanced MEMS Packaging (Electronic Engineering)

Advanced MEMS Packaging (Electronic Engineering)

McGraw-Hill Education

John Lau, Cheng Lee, C. Premachandran, Yu Aibin

Tahun:

2009

Bahasa:

english

Fail:

PDF, 13.97 MB

0 / 0

english, 2009

22

3D IC Integration and Packaging (Electronics)

3D IC Integration and Packaging (Electronics)

Tahun:

2015

Bahasa:

english

Fail:

PDF, 169.90 MB

0 / 0

english, 2015

23

Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Springer Singapore;Springer

John H. Lau, Ning-Cheng Lee

Tahun:

2020

Bahasa:

english

Fail:

PDF, 43.94 MB

5.0 / 5.0

english, 2020

24

Ultra-high frequency linear fiber optic systems

Ultra-high frequency linear fiber optic systems

Kam Y. Lau, John Park, Olav Solgaard

Tahun:

2009

Bahasa:

english

Fail:

PDF, 6.38 MB

0 / 0

english, 2009

25

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Kwok-Ying Lau (editor), John J. Drummond (editor)

Tahun:

2007

Bahasa:

english

Fail:

PDF, 2.37 MB

0 / 0

english, 2007

26

Solder Joint Reliability: Theory and Applications

Solder Joint Reliability: Theory and Applications

Colin MacKay (auth.), John H. Lau (eds.)

Tahun:

1991

Bahasa:

english

Fail:

PDF, 19.02 MB

0 / 0

english, 1991

27

Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

John H. Lau (auth.), John H. Lau PhD, PE (eds.)

Tahun:

1993

Bahasa:

english

Fail:

PDF, 26.43 MB

0 / 0

english, 1993

28

Advanced MEMS packaging

Advanced MEMS packaging

John H. Lau ... [et al.]

Tahun:

2010

Bahasa:

english

Fail:

PDF, 13.98 MB

0 / 0

english, 2010

29

Ultra-high Frequency Linear Fiber Optic Systems

Ultra-high Frequency Linear Fiber Optic Systems

Kam Y. Lau, John Park, Olav Solgaard

Tahun:

2009

Bahasa:

english

Fail:

PDF, 5.15 MB

0 / 0

english, 2009

30

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Springer Netherlands

Kah Kyung Cho (auth.), Kwok-Ying Lau, John J. Drummond (eds.)

Tahun:

2007

Bahasa:

english

Fail:

PDF, 1.23 MB

0 / 0

english, 2007

31

Electronics Packaging Forum: Volume Two

Electronics Packaging Forum: Volume Two

Springer Netherlands

John H. Lau, Steve J. Erasmus, Donald W. Rice (auth.), James E. Morris (eds.)

Tahun:

1990

Bahasa:

english

Fail:

PDF, 14.86 MB

0 / 0

english, 1990

32

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Springer Netherlands

Kah Kyung Cho (auth.), Kwok-Ying Lau, John J. Drummond (eds.)

Tahun:

2007

Bahasa:

english

Fail:

PDF, 4.08 MB

0 / 0

english, 2007

33

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Springer-Verlag Berlin Heidelberg

John Alan Robinson (auth.), John Lloyd, Veronica Dahl, Ulrich Furbach, Manfred Kerber, Kung-Kiu Lau, Catuscia Palamidessi, Luís Moniz Pereira, Yehoshua Sagiv, Peter J. Stuckey (eds.)

Tahun:

2000

Bahasa:

english

Fail:

PDF, 17.77 MB

0 / 0

english, 2000